High purity 99.99% Indium Tin Oxide/ ITO sputtering target bonding with Copper plate

Overview of High purity 99.99% Indium Tin Oxide/ ITO sputtering target bonding with Copper plate

A copper plate is a flat, thin sheet of pure copper or copper alloy, meticulously manufactured to precise dimensions and finishes for a broad spectrum of industrial, commercial, and artistic applications. These plates exhibit the inherent characteristics of copper, including high thermal and electrical conductivity, outstanding corrosion resistance, remarkable ductility, and an appealing aesthetic that evolves over time with a natural patina formation.

The production process typically involves rolling copper ingots or continuous casting strips to the desired thickness, followed by trimming and finishing operations to ensure a uniform surface and edge profile. Copper plates can be supplied in various grades, each tailored to specific end-use requirements. Common grades include tough pitch copper (electrical applications), phosphor bronze (wear-resistant applications), and brass (decorative and architectural use).

Features of High purity 99.99% Indium Tin Oxide/ ITO sputtering target bonding with Copper plate

1. High Conductivity: Copper is second only to silver in terms of electrical conductivity and thermal conductivity, making it ideal for electrical wiring, heat exchangers, and cooking utensils.

2. Corrosion Resistance: Copper forms a protective patina over time, which prevents further corrosion, allowing it to withstand harsh environments without significant degradation. This property is particularly useful in marine and industrial applications.

3. Malleability and Ductility: Copper can be easily shaped and formed into complex designs without fracturing, making it suitable for artistic and architectural applications like roofing, statues, and decorative elements.

4. Antimicrobial Properties: Copper naturally inhibits the growth of bacteria, viruses, and fungi, which makes it a preferred material for touch surfaces in healthcare facilities and food processing equipment.

5. Recyclability: Copper is highly recyclable with no loss of quality, contributing to sustainable practices and reducing the overall carbon footprint associated with its use.

6. Aesthetic Appeal: With its warm, reddish-brown hue, copper adds an attractive finish to architectural features and decorative items, often developing a greenish patina over time that is also aesthetically pleasing.

7. Variety of Grades and Thicknesses: Copper plates are available in different grades (such as pure copper, brass, or bronze) and a wide range of thicknesses to suit specific application requirements.

(High purity 99.99% Indium Tin Oxide/ ITO sputtering target bonding with Copper plate)

Parameters of High purity 99.99% Indium Tin Oxide/ ITO sputtering target bonding with Copper plate

The bonding properties of high purity 99.99% Indium Tin Oxide (ITO) sputtering targets and copper plates can be influenced by several factors, including the thickness of the sputtering targets, the pressure and temperature of the sputtering process, and the composition of the target and the metal being bonded.
To determine the bonding parameters for ITO/Cu sputtering targets and copper plates, it would be necessary to perform a series of experiments using these materials in different conditions. Some of the key parameters that could be measured include:

* Ternary composition: The ratio of ITO to Cu to Sn in the sputtering target can affect its bonding behavior. For example, a higher ratio of ITO to Cu may result in stronger bonding due to the presence of Sn atoms, which can act as an interface layer between the ITO andCu layers.
* Sputtering conditions: The pressure and temperature of the sputtering process can also impact bonding. Higher pressures and temperatures can increase the tendency of the metal ions to move more easily, leading to weaker bonding and faster sputtering rates. Conversely, lower pressures and temperatures can result in stronger bonding and slower sputtering rates.
* Target and metal surface chemistry: The chemical properties of the sputtering target and the metal being bonded can also influence bonding. For example, the presence of functional groups on the sputtering target can make it more conducive to certain types of bonding, such as chemical bonding or interfacial bonding. Similarly, the surface chemistry of the metal being bonded can influence bonding through processes such as adsorption and desorption.

Overall, the determination of bonding parameters for ITO/Cu sputtering targets and copper plates will require a combination of experimental techniques and theoretical modeling. By carefully controlling these parameters and monitoring the resulting bonding behavior, it is possible to optimize the performance of ITO/Cu sputtering targets and copper plates for specific applications.

(High purity 99.99% Indium Tin Oxide/ ITO sputtering target bonding with Copper plate)

Company Profile

Copper Channel is a trusted global metal material supplier & manufacturer with over 12-year-experience in providing super high-quality copper products and relatives products.

The company has a professional technical department and Quality Supervision Department, a well-equipped laboratory, and equipped with advanced testing equipment and after-sales customer service center.

If you are looking for high-quality copper materials and relative products, please feel free to contact us or click on the needed products to send an inquiry.

Payment Methods

L/C, T/T, Western Union, Paypal, Credit Card etc.

Shipment

It could be shipped by sea, by air, or by reveal ASAP as soon as repayment receipt.

FAQs of High purity 99.99% Indium Tin Oxide/ ITO sputtering target bonding with Copper plate

1. What are the common uses of High purity 99.99% Indium Tin Oxide/ ITO sputtering target bonding with Copper plate?

   • High purity 99.99% Indium Tin Oxide/ ITO sputtering target bonding with Copper plate is commonly used in electrical components, roofing, plumbing, artwork, cookware, industrial machinery, and as heat sinks in electronic devices.

2. Is High purity 99.99% Indium Tin Oxide/ ITO sputtering target bonding with Copper plate expensive compared to other metals?

   • The cost of copper fluctuates with market conditions but generally, it is more expensive than some other common metals like steel due to its superior conductivity and durability. However, its long-term value and recyclability can offset initial costs.

3. Can High purity 99.99% Indium Tin Oxide/ ITO sputtering target bonding with Copper plate be soldered or welded?

   • Yes, High purity 99.99% Indium Tin Oxide/ ITO sputtering target bonding with Copper plate can be both soldered and welded. They have excellent properties and are often joined using techniques like TIG welding, brazing, or soldering.

4. How does one clean and maintain High purity 99.99% Indium Tin Oxide/ ITO sputtering target bonding with Copper plate?

   • For basic cleaning, a mild soap and water solution is usually sufficient. For removing tarnish or stains, a mixture of salt, vinegar, and flour or commercial copper cleaners can be used. Avoid abrasive materials that might scratch the surface.

5. Does High purity 99.99% Indium Tin Oxide/ ITO sputtering target bonding with Copper plate rust?

   • Copper does not rust like iron; instead, it undergoes a process called patination, where it forms a greenish layer called patina. This patina actually protects the underlying copper from further corrosion.

6. Can High purity 99.99% Indium Tin Oxide/ ITO sputtering target bonding with Copper plate be used outdoors?

   • Absolutely, copper is highly resistant to weathering and its natural patination process enhances its durability outdoors, making it suitable for roofing, gutters, and outdoor sculptures.

(High purity 99.99% Indium Tin Oxide/ ITO sputtering target bonding with Copper plate)