99.99% Indium Tin Oxide/ Ito Sputtering Target Bonding With Copper Plate

Overview of 99.99% Indium Tin Oxide/ Ito Sputtering Target Bonding With Copper Plate

A copper plate is a flat, thin sheet of pure copper or copper alloy, meticulously manufactured to precise dimensions and finishes for a broad spectrum of industrial, commercial, and artistic applications. These plates exhibit the inherent characteristics of copper, including high thermal and electrical conductivity, outstanding corrosion resistance, remarkable ductility, and an appealing aesthetic that evolves over time with a natural patina formation.

The production process typically involves rolling copper ingots or continuous casting strips to the desired thickness, followed by trimming and finishing operations to ensure a uniform surface and edge profile. Copper plates can be supplied in various grades, each tailored to specific end-use requirements. Common grades include tough pitch copper (electrical applications), phosphor bronze (wear-resistant applications), and brass (decorative and architectural use).

Features of 99.99% Indium Tin Oxide/ Ito Sputtering Target Bonding With Copper Plate

1. High Conductivity: Copper is second only to silver in terms of electrical conductivity and thermal conductivity, making it ideal for electrical wiring, heat exchangers, and cooking utensils.

2. Corrosion Resistance: Copper forms a protective patina over time, which prevents further corrosion, allowing it to withstand harsh environments without significant degradation. This property is particularly useful in marine and industrial applications.

3. Malleability and Ductility: Copper can be easily shaped and formed into complex designs without fracturing, making it suitable for artistic and architectural applications like roofing, statues, and decorative elements.

4. Antimicrobial Properties: Copper naturally inhibits the growth of bacteria, viruses, and fungi, which makes it a preferred material for touch surfaces in healthcare facilities and food processing equipment.

5. Recyclability: Copper is highly recyclable with no loss of quality, contributing to sustainable practices and reducing the overall carbon footprint associated with its use.

6. Aesthetic Appeal: With its warm, reddish-brown hue, copper adds an attractive finish to architectural features and decorative items, often developing a greenish patina over time that is also aesthetically pleasing.

7. Variety of Grades and Thicknesses: Copper plates are available in different grades (such as pure copper, brass, or bronze) and a wide range of thicknesses to suit specific application requirements.

(99.99% Indium Tin Oxide/ Ito Sputtering Target Bonding With Copper Plate)

Parameters of 99.99% Indium Tin Oxide/ Ito Sputtering Target Bonding With Copper Plate

The Indium Tin Oxide (ITO) target bond is a widely used in the tin oxide industry for depositing and depositing a pure deposit on copper plates. It has been successfully applied to copper plate components to improve their electrical conductivity and film stability. The process of bonding it with a copper plate involves melting a small piece of copper into a molten metal, then applying it to a molten base material such as silicon or aluminum. The base material is allowed to cool down, and then the resulting is then melted back into a solid form.

There are several parameters that need to be considered when bonding an ITO target to a copper plate, including the composition of the base material, the tempering temperature, and the duration of the reaction. The specific parameters can vary depending on the desired properties of the target and the copper plate components being bonded. For example, if the base material contains too much copper, the ITO will not properly adsorb the zinc ions, causing the deposit to become adhered to the surface of the copper plate. If the base material contains too little copper, the ITO will not adhere well to the surface of the copper plate, resulting in a less consistent deposit.

To ensure that the ITO target bond is effective, a suitable calibration method must be used. This method involves heating the base material to a high temperature and it slowly to room temperature. The high temperature used to achieve this calibration allows the formation of a “TiO-Cu” bond that is resistant to heat under normal operating conditions. Additionally, the cooling rate must be appropriate to ensure that the bonds between the ITO target and the base material are completely self-assimilating.

Overall, the bonding of an ITO target to a copper plate requires careful consideration of various parameters, including the composition of the base material, the tempering temperature, and the duration of the reaction. By using appropriate calibration methods, a reliable and consistent ITO target bond can be obtained to increase the performance of your copper plate components.

(99.99% Indium Tin Oxide/ Ito Sputtering Target Bonding With Copper Plate)

Company Profile

Copper Channel is a trusted global metal material supplier & manufacturer with over 12-year-experience in providing super high-quality copper products and relatives products.

The company has a professional technical department and Quality Supervision Department, a well-equipped laboratory, and equipped with advanced testing equipment and after-sales customer service center.

If you are looking for high-quality copper materials and relative products, please feel free to contact us or click on the needed products to send an inquiry.

Payment Methods

L/C, T/T, Western Union, Paypal, Credit Card etc.

Shipment

It could be shipped by sea, by air, or by reveal ASAP as soon as repayment receipt.

FAQs of 99.99% Indium Tin Oxide/ Ito Sputtering Target Bonding With Copper Plate

1. What are the common uses of 99.99% Indium Tin Oxide/ Ito Sputtering Target Bonding With Copper Plate?

   • 99.99% Indium Tin Oxide/ Ito Sputtering Target Bonding With Copper Plate is commonly used in electrical components, roofing, plumbing, artwork, cookware, industrial machinery, and as heat sinks in electronic devices.

2. Is 99.99% Indium Tin Oxide/ Ito Sputtering Target Bonding With Copper Plate expensive compared to other metals?

   • The cost of copper fluctuates with market conditions but generally, it is more expensive than some other common metals like steel due to its superior conductivity and durability. However, its long-term value and recyclability can offset initial costs.

3. Can 99.99% Indium Tin Oxide/ Ito Sputtering Target Bonding With Copper Plate be soldered or welded?

   • Yes, 99.99% Indium Tin Oxide/ Ito Sputtering Target Bonding With Copper Plate can be both soldered and welded. They have excellent properties and are often joined using techniques like TIG welding, brazing, or soldering.

4. How does one clean and maintain 99.99% Indium Tin Oxide/ Ito Sputtering Target Bonding With Copper Plate?

   • For basic cleaning, a mild soap and water solution is usually sufficient. For removing tarnish or stains, a mixture of salt, vinegar, and flour or commercial copper cleaners can be used. Avoid abrasive materials that might scratch the surface.

5. Does 99.99% Indium Tin Oxide/ Ito Sputtering Target Bonding With Copper Plate rust?

   • Copper does not rust like iron; instead, it undergoes a process called patination, where it forms a greenish layer called patina. This patina actually protects the underlying copper from further corrosion.

6. Can 99.99% Indium Tin Oxide/ Ito Sputtering Target Bonding With Copper Plate be used outdoors?

   • Absolutely, copper is highly resistant to weathering and its natural patination process enhances its durability outdoors, making it suitable for roofing, gutters, and outdoor sculptures.

(99.99% Indium Tin Oxide/ Ito Sputtering Target Bonding With Copper Plate)