Overview of 4n Ito Ceramic Sputtering Targets Indium Tin Oxide Bonding With Copper Backing Plate For Thin Film Coating
A copper plate is a flat, thin sheet of pure copper or copper alloy, meticulously manufactured to precise dimensions and finishes for a broad spectrum of industrial, commercial, and artistic applications. These plates exhibit the inherent characteristics of copper, including high thermal and electrical conductivity, outstanding corrosion resistance, remarkable ductility, and an appealing aesthetic that evolves over time with a natural patina formation.
The production process typically involves rolling copper ingots or continuous casting strips to the desired thickness, followed by trimming and finishing operations to ensure a uniform surface and edge profile. Copper plates can be supplied in various grades, each tailored to specific end-use requirements. Common grades include tough pitch copper (electrical applications), phosphor bronze (wear-resistant applications), and brass (decorative and architectural use).
Features of 4n Ito Ceramic Sputtering Targets Indium Tin Oxide Bonding With Copper Backing Plate For Thin Film Coating
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High Conductivity: Copper is second only to silver in terms of electrical conductivity and thermal conductivity, making it ideal for electrical wiring, heat exchangers, and cooking utensils.
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Corrosion Resistance: Copper forms a protective patina over time, which prevents further corrosion, allowing it to withstand harsh environments without significant degradation. This property is particularly useful in marine and industrial applications.
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Malleability and Ductility: Copper can be easily shaped and formed into complex designs without fracturing, making it suitable for artistic and architectural applications like roofing, statues, and decorative elements.
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Antimicrobial Properties: Copper naturally inhibits the growth of bacteria, viruses, and fungi, which makes it a preferred material for touch surfaces in healthcare facilities and food processing equipment.
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Recyclability: Copper is highly recyclable with no loss of quality, contributing to sustainable practices and reducing the overall carbon footprint associated with its use.
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Aesthetic Appeal: With its warm, reddish-brown hue, copper adds an attractive finish to architectural features and decorative items, often developing a greenish patina over time that is also aesthetically pleasing.
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Variety of Grades and Thicknesses: Copper plates are available in different grades (such as pure copper, brass, or bronze) and a wide range of thicknesses to suit specific application requirements.
(4n Ito Ceramic Sputtering Targets Indium Tin Oxide Bonding With Copper Backing Plate For Thin Film Coating)
Parameters of 4n Ito Ceramic Sputtering Targets Indium Tin Oxide Bonding With Copper Backing Plate For Thin Film Coating
The concept of using nisubstrate in a ceramic sputtering target is an emerging application in the field of nanotechnology and materials science. The specific parameters required for this type of technology include the introduction of a unique film coating that adheres to ni substrates with copper backing plate.
The ni substrate is usually made from niyan to form films with high strength and durability. These films are then applied to a chemical bond between ni substrates and copper backplate, resulting in a strong connection that bonds ni substrates together while protecting them from corrosion and physical damage.
In order to achieve the desired properties, the design of the ni substrate must be carefully considered. This includes factors such as the layer thickness and composition of the film, the ratio of ni-substrate-to-copper-backplate mixture, and the conditions under which the ni substrate is used.
In addition to the technical specifications required, there are also several parameters that need to be taken into account when designing a sputtering target for thin film coating. These include the material of the target and its geometry, the layer thickness, and the quality of the target.
Overall, the use of nisubstrate in a ceramic sputtering target offers a promising way to improve the performance of thin film coatings and could have significant applications in a wide range of fields, including aerospace, energy, and manufacturing. However, it is important to carefully consider the technical details and parameter requirements before embarking on a new project.
(4n Ito Ceramic Sputtering Targets Indium Tin Oxide Bonding With Copper Backing Plate For Thin Film Coating)
Company Profile
Copper Channel is a trusted global metal material supplier & manufacturer with over 12-year-experience in providing super high-quality copper products and relatives products.
The company has a professional technical department and Quality Supervision Department, a well-equipped laboratory, and equipped with advanced testing equipment and after-sales customer service center.
If you are looking for high-quality copper materials and relative products, please feel free to contact us or click on the needed products to send an inquiry.
Payment Methods
L/C, T/T, Western Union, Paypal, Credit Card etc.
Shipment
It could be shipped by sea, by air, or by reveal ASAP as soon as repayment receipt.
FAQs of 4n Ito Ceramic Sputtering Targets Indium Tin Oxide Bonding With Copper Backing Plate For Thin Film Coating
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What are the common uses of 4n Ito Ceramic Sputtering Targets Indium Tin Oxide Bonding With Copper Backing Plate For Thin Film Coating?
- 4n Ito Ceramic Sputtering Targets Indium Tin Oxide Bonding With Copper Backing Plate For Thin Film Coating is commonly used in electrical components, roofing, plumbing, artwork, cookware, industrial machinery, and as heat sinks in electronic devices.
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Is 4n Ito Ceramic Sputtering Targets Indium Tin Oxide Bonding With Copper Backing Plate For Thin Film Coating expensive compared to other metals?
- The cost of copper fluctuates with market conditions but generally, it is more expensive than some other common metals like steel due to its superior conductivity and durability. However, its long-term value and recyclability can offset initial costs.
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Can 4n Ito Ceramic Sputtering Targets Indium Tin Oxide Bonding With Copper Backing Plate For Thin Film Coating be soldered or welded?
- Yes, 4n Ito Ceramic Sputtering Targets Indium Tin Oxide Bonding With Copper Backing Plate For Thin Film Coating can be both soldered and welded. They have excellent properties and are often joined using techniques like TIG welding, brazing, or soldering.
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How does one clean and maintain 4n Ito Ceramic Sputtering Targets Indium Tin Oxide Bonding With Copper Backing Plate For Thin Film Coating?
- For basic cleaning, a mild soap and water solution is usually sufficient. For removing tarnish or stains, a mixture of salt, vinegar, and flour or commercial copper cleaners can be used. Avoid abrasive materials that might scratch the surface.
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Does 4n Ito Ceramic Sputtering Targets Indium Tin Oxide Bonding With Copper Backing Plate For Thin Film Coating rust?
- Copper does not rust like iron; instead, it undergoes a process called patination, where it forms a greenish layer called patina. This patina actually protects the underlying copper from further corrosion.
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Can 4n Ito Ceramic Sputtering Targets Indium Tin Oxide Bonding With Copper Backing Plate For Thin Film Coating be used outdoors?
- Absolutely, copper is highly resistant to weathering and its natural patination process enhances its durability outdoors, making it suitable for roofing, gutters, and outdoor sculptures.
(4n Ito Ceramic Sputtering Targets Indium Tin Oxide Bonding With Copper Backing Plate For Thin Film Coating)
